Department of Mechanical Electronics

Name: Xingxi He

Title:  Lecturer

Email Address:

Office Room Number: A7408

Office Tel:

Background of Education and Work Experience

  • 2003/92008/5, Virginia Tech, Ph.D. , Mechanical Engineering

  • 2001/92003/8, Ohio University, M.S. , Mechanical Engineering

  • 1997/92001/6, Beijing University of Aero & Astro, B.S, Mechanical Engineering and Automation

Research Field

  • Augmented Reality

  • Deep Learning and Fault Diagnosis


Research and Honors

  • Hong Zeng, Xingxi He, Honghu Pan, Implementation of escape room system based on augmented reality involving deep convolutional neural network. Virtual Reality (2020).

  • Zeng H., He X., Pan H. (2019) A New Practice Method Based on KNN Model to Improve User Experience for an AR Piano Learning System. v 11575 LNCS, p 398-409, 2019,  VAMR 2019, Held as Part of the 21st HCI International Conference, HCII 2019, Proceedings

  • Zeng H., He X., Pan H. (2019) FunPianoAR: A Novel AR Application for Piano Learning Considering Paired Play Based on Multi-Marker Tracking. Journal of Physics: Conference Series, v 1229, n 1, May 29, 2019, 2019 3rd International Conference on Machine Vision and Information Technology, CMVIT 2019 (Best Presenter Prize)

  • Pan H., He X., Tang S.,  An Improved Bearing Fault Diagnosis Method using One-Dimensional CNN and LSTM, Strojniski Vestnik-Journal of Mechanical Engineering, 2018, 64(7-8): 443-452.

  • Pan H., He X., Zeng H., Zhou J., Tang S., Pilot Study of Piano Learning with AR Smart Glasses Considering both Single and Paired Play,  v 10927 LNCS, p 561-570, 2018, 4th International Conference, ITAP 2018, Held as Part of HCI International 2018, Proceedings.  

  • He X., Leo D J, Akle B, Multi-scale Modeling of Ion Transport in High-strain Ionomers with Conducting Powder Electrodes, Journal of Intelligent Material Systems and Structures, 2014, 25(10): 1196~1210.

  • R.L. Williams II, X. He, T. Franklin, and S. Wang,  “Haptics-Augmented Engineering Mechanics Educational Tools”, World Transactions on Engineering and Technology Education, 2007, 6(1): 27-30.